Chii chaitika
Vatsvagiri kubva kuYunivhesiti yeTekinoroji Sydney, ShanghaiTech University, uye Technical University yeMunich vakaburitsa IC-ThermBench, nyowani yakavhurika-sosi bhenji yekuongorora AI-inotyairwa thermal modeling mune advanced semiconductor packaging. Iyo inosanganisira dataset ye50,000 samples yakanangana ne 2.5D chiplet architecture, padivi pemabasa aripo e3D-IC steady-state uye yenguva pfupi yekupisa kupisa.
Iyo IC-ThermBench purojekiti, yakatsanangurwa mubepa naHang et al., inogadzirisa kuomarara kuri kukura kwekupisa kwemoto mukugadzira chip dhizaini. Nzira dzechinyakare dzekutevedzera dzinowanzo kudhura zvakanyanya, zvichikonzera kutorwa kweAI-based surrogates. Nekudaro, aya mamodheru anowanzo kunetsekana ne 'kunze-kwe-kugovera' (OOD) mamiriro apo iyo chip dhizaini inotsauka kubva kudhata rekudzidzisa.
Iyo yakagadzirirwa kufambira mberi, zvichireva kuti inoedza mamodheru pamabasa ari kuramba achioma. Inosanganisira 50,000-sample yekuwedzera yakanangana ne2.5D chiplets, iyo iri kuwedzera kuwanda muAI accelerators uye yepamusoro-yekupedzisira processors. Chinangwa ndechekuongorora kuti maAI mamodheru anogona kuendesa ruzivo rwavo rwefizikisi yakadzidza mumhando dzakasiyana dzepakeji uye masisitimu emuviri.
Kwakabva mashoko: semiengineering.com ↗
Nei zvichikosha
Sezvo semiconductor madhizaini anochinjika akananga ku2.5D uye 3D zvivakwa kuti akunde mabhodhoro ekuita, kutonga kwekupisa kwave kunetsa kweinjiniya. AI modhi dziri kuwedzera kushandiswa kufanotaura kugovera kupisa mune idzi dense, dzakawanda-layered chips. IC-ThermBench inopa nzira yakamisikidzwa yekuyera kuti mamodheru aya anosarudzika sei mukusiyana kwakasiyana kwemuviri uye kuchinjika-pakeji masisitimu, izvo zvakakosha pakuona kuvimbika kwechizvarwa chinotevera chepamusoro-chinoita computing Hardware. Nekupa inofambira mberi yekuongorora maitiro, iyo bhenji inobatsira vaongorori kuona uko maAI mamodheru anotadza kuzvidavirira kune akaomesesa emagetsi emagetsi mune asiri echinyakare chip marongero, zvichigona kukurumidza kusimudzira kuvandudzwa kweakawanda akasimba ekudziya ekuenzanisa maturusi eiyo semiconductor indasitiri.
Thermal manejimendi ndiyo inonyanya kumanikidza mukugadzirwa kwe3D-ICs, uko kupisa density kwakakwira zvakanyanya kupfuura mune yechinyakare 2D machipisi. Kusarurama kwemhando yekupisa kunogona kutungamirira kukuita throttling kana hardware kukundikana.
Mabhenji akamisikidzwa senge IC-ThermBench anodiwa kufambisa AI yekupisa modhi kubva mukutsvagisa kwedzidzo kuenda kune yakavimbika maindasitiri maitiro. Nekupa yadhi yakajairwa, vaongorori vanovavarira kukurudzira zvirinani kuenzanirana mumamodheru, kuve nechokwadi kuti vanogona kubata akasiyana uye ari kubuda mamiriro echiplet-based dhizaini.
Interactive Mechanism: Iyo Inonyatsoshanda
Ongorora ari pasi tekinoroji kuseri kwekusimudzira uku uchipindirana.
Which component of an AI application is the machine-learning model itself?
Zvekutarisa zvinotevera
Chikwata chekutsvagisa chakaburitsa mucherechedzo searXiv preprint (arXiv:2608.23977). Zviitiko zveramangwana zvingangotarisa kuti indasitiri-yakajairwa EDA (Electronic Design Automation) vanopa maturusi vanotora aya metrics kuti vasimbise yavo AI-yakabatanidzwa thermal simulation maficha. Izvo zvinoramba zvichionekwa kuti mamodheru aya anoita sei zvinobudirira kana akaiswa kune chaiyo-nyika, proprietary chip dhizaini iyo inogona kusiyana zvakanyanya kubva kubhenji rekugadzira kana redzidzo dataset.
Iyo parizvino iripo seyakavhurika-sosi sosi yenharaunda yekutsvagisa. Vacherechedzi vanofanirwa kutarisa kana ichi bhenji chikava chirevo chakajairwa cheAI-inotyairwa thermal simulation mapepa mune inotevera semiconductor uye muchina kudzidza makonferensi.
Chinhu chikuru chisingazivikanwe hukuru hunoenderana neaya mabhenji ezvidzidzo nekuita kwekutengesa-giredhi remafuta simulation software inoshandiswa nevagadziri vakuru vesemiconductor.