Kwenzekeni
I-Cadence imemezele ukubambisana okunwetshiwe ne-TSMC ukuze kuhlinzekwe ngamakhono okuklama athuthukile we-AI kanye nama-chips e-high-performance computing (HPC). Ukusebenzisana kuhlanganisa ukuqinisekiswa kwamathuluzi e-Cadence edijithali, okusayinwa, kanye nezifiso/i-analog yobuchwepheshe benqubo ye-TSMC ye-A14 kanye ne-A16. Ukwengeza, izinkampani zinika amandla ukugeleza kwedizayini ye-AI chip nokwesekwa okunwetshiwe kobuchwepheshe be-TSMC be-3DFabric, obuvumela ukuhlanganiswa kwamakhulu ama-chiplets ezinhlelweni zesikali se-wafer.
Ukugeleza okugcwele kwedijithali kweCadence, okuhlanganisa i-Innovus Implementation System kanye ne-Cerebrus Intelligent Chip Explorer, manje sekugunyazwe izinqubo ze-TSMC ze-A16 ne-A14. Ngomklamo wangokwezifiso ne-analog, i-Virtuoso Studio suite manje isekela ukuthuthela kwedizayini okuzenzakalelayo kulawa ma-node, i-Cadence ethi inganciphisa ukuphindaphinda kwedizayini kufika kuzikhathi ezingu-2.5.
Ngaphambili kwe-IP, i-Cadence ikhiphe i-UCIe-64G ngenqubo ye-A14, ne-LPDDR6 IP esathuthukiswayo njengamanje. Ngenqubo ye-N2P, i-Cadence iqinisekise ukugeleza kwayo kwe-analog, digital, kanye nokusayina, ne-DDR5, LPDDR5, ne-PCIe 6.0 IP esezikhishiwe.
Ubambiswano luphinde ludlulele ekufakweni okuthuthukisiwe, ikakhulukazi ukusekela ukugeleza komklamo we-TSMC's SoW-X (System-on-Wafer). Lokhu kunika amandla ukuklanywa kwamasistimu anamakhulu ama-chiplets nezigidi zamabhampu, kusetshenziswa inkundla ye-Integrity 3D-IC yokuhlela uhlelo. Ukwengeza, izinkampani zinikeze amandla ukuhlanganiswa kwe-TSMC-COUPE (Compact Universal Photonic Engine) ne-Cadence's 224G SerDes IP ukusekela ukuxhumana komkhawulokudonsa ophezulu.
Imininingwane yomthombo: hpcwire.com ↗
Kungani kubalulekile
Lokhu kubambisana kubalulekile embonini ye-semiconductor njengoba ibhekana ngqo nobunzima obandayo bokuklama ama-accelerator e-AI kanye nezinhlelo ze-hyperscale. Ngokuqinisekisa amathuluzi okuklama amanodi athuthuke kakhulu e-TSMC (A14, A16, N2P), i-Cadence ihlinzeka abaklami bama-chip nengqalasizinda edingekayo yokuthuthukisa amandla, ukusebenza, kanye namamethrikhi endawo (i-PPA). Ukuhlanganiswa kokugeleza kwedizayini ye-agent ye-AI kanye nokusekelwa okuthuthukisiwe kokupakishwa kwe-3D-IC kusiza ukunciphisa imijikelezo yentuthuko kanye neshejuli yezingozi zezinkampani ezakha isizukulwane esilandelayo sehadiwe ye-AI. Njengoba amamodeli e-AI ekhula ngosayizi futhi adinga ikhompuyutha eyengeziwe, amandla okuklama nokukhiqiza amasistimu ayinkimbinkimbi, ama-chiplet amaningi aba ibhodlela eliyinhloko lokhu kubambisana okuhlose ukukuxazulula.
Imboni ye-semiconductor okwamanje ibhekene 'nodonga oluyinkimbinkimbi' lapho idizayini yama-chips aqondene ne-AI idinga ukuphatha izigidigidi zama-transistors kanye nezakhiwo eziyinkimbinkimbi ze-3D-IC. Ngokuhlinzeka nge-IP efakazelwe nge-silicon kanye nokugeleza kwedizayini eqinisekisiwe, i-Cadence yehlisa 'ingozi yeshejuli' yezinkampani ezifana ne-Global Unichip Corp. (GUC), ezithembele kulawa mathuluzi ukuletha i-silicon yangokwezifiso kumasistimu we-hyperscale. Ukushintshela ekugelezeni kwedizayini ye-AI ye-agent kumele iqhubekele ekuzenzeni izingxenye ezidinga abasebenzi abaningi kakhulu zenqubo yokuklama i-chip, okungase kuvumele onjiniyela ukuthi bagxile ezinqumweni zezinga eliphezulu lezakhiwo. Lokhu kubambisana kuqinisekisa ukuthi amathuluzi esoftware ayisisekelo ahambisana nokuvela ngokushesha kwezindawo zokukhiqiza ze-TSMC, okubalulekile ekugcineni umkhondo wokusebenza kwengqalasizinda ye-AI.
I-Interactive Mechanism: Indlela Esebenza Ngayo Ngempela
Hlola ubuchwepheshe obuyisisekelo ngemuva kwalokhu kuthuthukiswa ngokuhlanganyela.
crm_get_transaction(id='4092').In AI, what are a model's "parameters"?
Ongakubuka ngokulandelayo
Izibukeli zemboni kufanele ziqaphe ukutholakala kwe-Q4 2026 kwe-Artisan Foundation IP kanye ne-IP yesiginali exubile yenqubo ye-A14, njengoba lokhu kubalulekile kubathuthukisi abaqala imijikelezo yabo yokuklama. Ngaphezu kwalokho, izinga lokwamukelwa kokugeleza kwedizayini ye-AI ye-agent esanda kuqinisekiswa phakathi kwabakhiqizi abakhulu be-semiconductor kuzoba inkomba ebalulekile yokuthi la mathuluzi anganciphisa ngokushesha kangakanani ukuphindwaphindwa kwedizayini futhi athuthukise isikhathi ukuya emakethe ye-silicon eqondene ne-AI. Ukusebenza kokuhlanganiswa kwenjini ye-photonic ye-TSMC-COUPE ne-Cadence's 224G SerDes IP ezinhlelweni ze-HPC zomhlaba wangempela kuhlala kuyingqopha-mlando ebalulekile yobuchwepheshe okufanele ilandelwe.
Okungaziwa okuyinhloko kuseyizinzuzo ezithile zokusebenza ezizotholwa amakhasimende ngamanye lapho eshintshela kumanodi e-A14 kanye ne-A16 esebenzisa lokhu kugeleza okusha, njengoba imiphumela yomhlaba wangempela ivame ukuhluka kumabhentshimakhi etiyetha. Ukwengeza, ngenkathi i-Cadence imemezele ukuthuthukiswa kwamabhulokhi ahlukahlukene we-IP, isivuno sangempela nokuzinza kwalezi zingxenye ekukhiqizeni okusesigabeni sangaphambi kwesikhathi kuzobaluleka empumelelweni yegagasi lokuqala lama-chips e-A14 asekelwe ku-A14. Imakethe izophinde ibukele ukuze ibone ukuthi izimbangi zisabela kanjani ekuhlanganisweni kokugeleza kwe-AI ye-agent, njengoba lokhu kungase kubeke izinga elisha le-design automation emkhakheni we-semiconductor.