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LG Electronics disclosed plans to invest 150 billion won (about $110 million) in a new chiller manufacturing facility in Windsor, Virginia. The plant, covering 32,000 m² on a 170,000 m² site, will begin production in the first half of 2027 and will focus on air‑cooled chillers designed for AI data centers. The company also announced parallel expansions in South Korea, adding air‑cooled chiller lines at its Pyeongtaek and Changwon plants and upgrading production lines to run multiple streams simultaneously by year‑end. LG’s “chip to chiller” portfolio will be broadened to include coolant distribution units and cold plates that directly absorb heat from chips. In Asia, LG is supplying an integrated cooling solution for a hyperscale AI data center under construction in Jakarta, combining its HVAC technology with battery solutions from LG Energy Solution and data‑center expertise from LG CNS.
LG Electronics said Thursday it will invest 150 billion won ($110 million) to build a chiller plant in Virginia and expand production in Korea, as demand for cooling systems rises with the growth of AI data centers.
The company plans to start production at the new plant in Windsor, Virginia, in the first half of 2027. The facility will span 32,000 square meters on a 170,000‑square‑meter site and produce air‑cooled chillers mainly for AI data centers.
In Korea, LG is adding air‑cooled chiller lines at its plants in Pyeongtaek, Gyeonggi Province, and Changwon, South Gyeongsang Province, while upgrading production facilities. It will also introduce a flow‑line system and plans to run multiple production lines simultaneously by year‑end.
The company is also expanding its “chip to chiller” portfolio, which covers cooling systems from individual chips to large‑scale equipment. The lineup includes coolant distribution units and cold plates that absorb heat directly from chips.
In Asia, LG is supplying an integrated solution to a hyperscale AI data center being built in Jakarta by Indonesia’s Sinar Mas Group, combining LG Electronics’ heating, ventilation and air conditioning technologies with battery solutions from LG Energy Solution and data center expertise from LG CNS.
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The announcement signals a concrete response to the rapidly growing power and thermal requirements of AI‑driven data centers. Market researcher Omdia projects global data‑center power capacity to rise from 226 GW this year to 420 GW by 2030, with North America accounting for roughly 60 percent of that demand. By locating production closer to major North American customers, LG aims to shorten delivery lead times and improve supply‑chain resilience, addressing a known bottleneck in AI infrastructure scaling. The expansion also diversifies LG’s cooling portfolio beyond modular units, adding large‑scale chiller capacity that can support the next generation of high‑density AI hardware. This move may influence competitive dynamics among cooling‑equipment vendors and could affect the cost structure of AI data‑center deployments, potentially lowering barriers for enterprises seeking to expand AI workloads.
Global power capacity required by data centers is expected to rise from 226 GW this year to 420 GW by 2030, with North America accounting for about 60 percent, according to market researcher Omdia. This growth drives demand for high‑capacity, efficient cooling solutions.
Locating production in Virginia shortens delivery times and improves supply stability for North American AI data‑center operators, mitigating a known risk of long lead times for specialized cooling equipment.
LG’s expansion of its “chip to chiller” portfolio demonstrates a strategic shift toward offering end‑to‑end thermal management solutions, potentially lowering total‑cost‑of‑ownership for AI hardware deployments.
The Jakarta project illustrates LG’s intent to provide integrated cooling solutions in emerging markets, which could set a precedent for similar deployments across Southeast Asia.
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Key developments to monitor include: (1) the timeline and any potential delays in the Virginia plant’s construction and commissioning; (2) pricing and availability details for the new air‑cooled chillers once production starts; (3) adoption rates among major hyperscale cloud providers and AI‑focused data‑center operators in North America; and (4) whether LG’s integrated “chip to chiller” solutions gain traction in emerging markets such as Southeast Asia, where the Jakarta project may serve as a pilot.
Construction progress and any schedule changes for the Virginia plant, which could affect the timing of new chiller availability.
Pricing and commercial terms for the air‑cooled chillers once they enter production, as these will determine adoption speed among data‑center operators.
The response of major hyperscale cloud providers (e.g., Amazon, Microsoft, Google) to LG’s new offering, including potential contracts or pilot programs.
Further announcements of integrated cooling solutions for AI data centers in other regions, especially in fast‑growing markets like Southeast Asia.